GlobalFoundries, Xanadu's fab partner, signs $2bn US interposer deal with TSMC

GlobalFoundries (Nasdaq: GFS) announces a multi-year, $2 billion manufacturing agreement with TSMC to supply silicon interposers made in the US for TSMC's CoWoS advanced packaging. The deal concerns AI and high-performance computing chips, not quantum hardware. It matters here because GlobalFoundries is also Xanadu's manufacturing partner, as in the Xanadu and GlobalFoundries photonic quantum partnership.

GF will provide manufacturing services to TSMC and add fabrication capacity at its Malta, New York facility. It expects to become the first US-based source of silicon interposers for advanced packaging, including embedded deep trench capacitor components. The agreement has an initial term of five years and provides a framework for expanding capacity as customer demand grows.

GF expects volume production to begin ramping at Malta in the first half of 2028. Ed Kaste, GF's senior vice president of CMOS Business, said advanced packaging is becoming critical to the performance, power efficiency and scale of next-generation AI systems, and called GF's US manufacturing footprint a secure, scalable source of packaging elements.

The announcement says nothing about quantum components or about any effect on GF's work for Xanadu. What it shows is a large new AI packaging commitment at a US foundry that also builds quantum photonic hardware.